The cupric sulphate plating applies the phosphorus copper anode with 0.04-0.065% phosphorus content， meticulous crystallization and evenly distributed phosphorus, which enables the phosphorus copper anode to form a black film quickly in the tank and dissolve evenly to make the plating steady and sustained.
　　The phosphorus copper anode has a copper content of over 99% with few impurities, little mud, long cycle of solution disposal and less trouble.