1,Features
KY-968 thermal conductive potting compound
is one kind of condensed type
two-component silicone thermal conductive adhesive, is consisted of silicone-based polymer, thermal conductive filler, reinforcing filler, flame retardant additives and curing agents.
2,Uses
• For the heat dissipation of heated parts of electronic components
• For the potting of electronic power supply, power switch
3,Technical parameters after/before curing (not for product standard)
No. |
Item |
Technical parameters |
Testing standards |
Before curing |
1 |
Appearance |
KY-968A |
KY-968B |
/ |
White or black fluid |
Colorless \ light yellow transparent liquid |
2 |
Mixture viscosity (mPa·S)(25℃)
|
3000～7000 |
GB10247-1988 |
3 |
Specific gravity (g/cm3) |
1.3～1.8 |
GB/T 1344.2-2002 |
4 |
Period of application (min)(25℃)
|
30～90 |
GB/T 16776-2005 |
5 |
Initial curing time (h) |
2～4 |
/ |
6 |
Full curing time (h) |
24 |
/ |
After curing (23±2℃, Humidity 50±5% for seven days) |
7 |
Appearance |
Elastic rubber |
/ |
8 |
Shore A hardness |
40～70 |
GB/T 531-1999 |
9 |
Tensile strength (MPa) |
≥1.5 |
GB/T 528-1998 |
10 |
Volume resistivity (Ω.cm) |
≥1χ1014 |
GB/T 1692-1992 |
12 |
Dielectric strength (kV/mm) |
≥18 |
GB 1695-1981 |
13 |
Dielectric constant (1MHz) |
3.0～3.5 |
GB 1694-1981 |
14 |
Flame retardant rating |
FV–0 |
GB/T 13488-1992 |
15 |
Thermal conductivity (W/m·K) |
0.4～0.8 |
GB 11205-1989 |
4 , Colors
• Or following your demands.
5 , Packing
• KY-968 27.5kg in plastic drum (25kg+2.5kg).
• Or following your demands.
6 ,Storage and transportation
• Stored at 4 ° C ~ 27 ° C in a cool and dry place; storage period is 9 months from the date of manufacture, please note the date of manufacture on the product packaging.
• Non-dangerous goods . |
KY-968 two-component condensed type thermal conductive potting compound 