1 , Features
KY-958 thermal conductive potting compound
is one kind of condensed type
one-component silicone thermal conductive adhesive, is consisted of silicone-based polymer, thermal conductive filler, reinforcing filler, flame retardant additives and curing agents.
2 , Uses
• For the heat dissipation of heated parts of electronic components
• for the heat dissipation of high-power lamps
3, Technical parameters after/before curing (not for product standard)
No. |
Item |
Technical parameters |
Testing standards |
Before curing |
1 |
Appearance |
White paste |
/ |
2 |
Surface drying time (25℃), min |
≤20 |
GB/T 13477.5-2002 |
3 |
Full curing time , D |
7 |
/ |
After curing (23±2℃, Humidity 50±5% for seven days) |
4 |
Appearance |
White Elastic rubber |
/ |
5 |
Density |
1.6～2.0 |
GB/T 533-2008 |
6 |
Hardness , Shore A (cured at 25℃ for 2h) |
40～70 |
GB/T 531.2-2009 |
7 |
Tensile strength , MPa |
2.0～3.0 |
GB/T 528-2009 |
8 |
Volume resistivity , Ω.cm |
≥1χ1014 |
GB/T 1692-2008 |
9 |
Dielectric strength , kV/mm |
≥18 |
GB/T 1695-2005 |
10 |
Dielectric constant (1MHz) |
3.4 |
GB/T 1693-2007 |
11 |
Flame retardant rating |
UL94 V–0 |
GB/T 10707-2008 |
12 |
Thermal conductivity , W/m·K |
0.6～1.0 |
GB/T 11205-2009 |
4 , Colors
• Or following your demands.
5 , Packing
• KY-611 Net wt 300ml plastic drum, 100ml Toothpaste tube.
• Or following your demands.
6 , Storage and transportation
• Stored at 4 ° C ~ 27 ° C in a cool and dry place; storage period is 9 months from the date of manufacture, please note the date of manufacture on the product packaging.
• Non-dangerous goods . |
KY-958 one-component condensed type thermal conductive potting compound 