1 , Features
KY-928 thermal conductive potting compound
is one kind of addition
type two-component thermal conductive silicone rubber, can be cured at room temperature or quick cured in heated condition.
2, Uses
• Used in the potting, bonding, positioning, sealed, waterproof of electronic components and electrical equipments
• For the heat dissipation of heated parts of electronic components
• For the heat dissipation of power supply
3 , Technical parameters after/before curing (not for product standard)
No. |
Item |
Technical parameters |
Testing standards |
Before curing |
1 |
Appearance |
KY-928A |
KY-928B |
/ |
gray fluid |
White fluid |
2 |
Viscosity , mPa·s
(25℃) |
component A |
3000～8000 |
GB/T 10247-2008 |
component B |
3000～8000 |
3 |
Period of application , min
(At room temperature) |
≥20 |
GB/T 16776-2005 |
4 |
Initial curing time , h |
≤2 |
no flow |
After curing (23±2℃, Humidity 50±5% for seven days) |
5 |
Appearance |
gray Elastic rubber |
/ |
6 |
Density |
1.35～1.85 |
GB/T 533-2008 |
7 |
Hardness , Shore A (cured at 25℃ for 2h) |
35～70 |
GB/T 531.2-2009 |
8 |
Tensile strength , MPa |
1.2～2.5 |
GB/T 528-2009 |
9 |
Shear strength , Mpa |
≥1.0 |
GB/T 7124-2008 |
10 |
Volume resistivity , Ω.cm |
≥1χ1015 |
GB/T 1692-2008 |
11 |
Dielectric strength , kV/mm |
18～23 |
GB/T 1695-2005 |
14 |
Dielectric constant (1MHz) |
3.1～3.4 |
GB/T 1693-2007 |
15 |
Flame retardant rating |
UL94 V–0 |
GB/T 10707-2008 |
16 |
Thermal conductivity , W/m·K |
0.4～1.0 |
GB/T 11205-2009 |
4 , Colors
• KY-928component A is gray fluid, component B is White fluid, mixture of component A, component B is gray fluid
• Or following your demands.
5 , Packing
• 1.0kg plastic bottle (0.5kg+0.5kg),30kg plastic drum (15.0kg+15.0kg).
• Or following your demands.
6 , Storage and transportation
• Stored at 4 ° C ~ 27 ° C in a cool and dry place; storage period is 9 months from the date of manufacture, please note the date of manufacture on the product packaging.
• Non-dangerous goods .
|
KY-928 two-component addition type thermal conductive potting compound 