Dicyandiamide-Electronic Grade
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Application: |
Used as curing agent for epoxy adhesive in FR-4 CCL production |
Specification: |
White crystal or powder.Relative density is 1.40,melting point is 209-212°C.It is soluble in water and alcohol,almost insoluble in ethyl ether and benzene.Stable when dry.Non-flammable. |
Purity |
≥99.8% |
Moisture |
≤0.20% |
Ash content |
≤0.02% |
Melting point |
209-212°C |
Calcium content |
≤25µg/g |
Fe content |
≤2µg/g |
Solubility |
Passed test |
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