Dicyandiamide-Electronic Grade
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| Application: |
Used as curing agent for epoxy adhesive in FR-4 CCL production |
| Specification: |
White crystal or powder.Relative density is 1.40,melting point is 209-212°C.It is soluble in water and alcohol,almost insoluble in ethyl ether and benzene.Stable when dry.Non-flammable. |
| Purity |
≥99.8% |
| Moisture |
≤0.20% |
| Ash content |
≤0.02% |
| Melting point |
209-212°C |
| Calcium content |
≤25µg/g |
| Fe content |
≤2µg/g |
| Solubility |
Passed test |
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