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Low pressure injection molding series: RX-
Film-making resin series:RXH-
Bonding adhesive series:RXM-
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    Address:Daping industrial park, Lianfeng town, Liancheng county, Fujian, China (366200)
    Tel:0086-597-8925669
    Fax:0086-597-8925669
    Contact:Mr. Li 0086-18950823130
    E-mail:sales@rx-chemical.com
    URL:http://www.rx-chemical.com

Bonding adhesive series

1. For the bonding of metal and ABS plastics, such as stainless steel outer case and ABS plastics. Film thickness: 0.1mm (or upon clients' demand).

Bonding adhesive series

2. For aluminium honeycomb slab. This hot-melt film features 0.1mm(or upon clients' demand)

aluminium honeycomb slab


3. For the encapsulation of chip of IC card. It is resistant to high and low temperature, and is suitable for the encapsulation of any kind of IC card. Film thickness: 0.8mm(or upon clients' demand)

encapsulation of chip of IC card. It is resistant to high and low temperature

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